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| EMIF02-USB05C2 IPADTM 2 line EMF filter including ESD protection Main application When EMI filtering is ESD sensitive equipment is required: Mobile phones and communication systems Computers, printers and MCU boards Description The EMIF02-USB05C2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB05C2 FlipChip packaging means the package size is equal to the die size. Additionally, this low-pass filter includes an ESD protection circuitry to prevent damage to the application when subjected to ESD surges up to 15 kV. This device is designed to be fully compatible with USB standards. Coated Flip-Chip (8 Bumps) Pin configuration (bump side) 2 IO4 O2 O1 IO3 1 VCC I2 I1 GND A B C D Benefits 2 x EMI low-pass filter + 2 line ESD protection 1.5 k pull-up included High efficiency in EMI filtering Lead free coated package Very low PCB space consumption: 1.92 mm x 0.92 mm Very thin package: 0.69 mm High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging USB full speed (12 Mbps), OTG compliant Functional diagram IO4 IO3 R1 Input 2 Output2 R3 VCC GND R2 Input 1 Output 1 Order code Part Number EMIF02-USB05C2 Marking GV Complies with following standards: IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3 TM: IPAD is a trademark of STMicroelectronics Rev 2 1/7 www.st.com 7 November 2006 Characteristics EMIF02-USB05C2 1 Characteristics Table 1. Symbol Tj Top Tstg Absolute ratings (limiting values) Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 - 40 to + 85 - 55 to + 150 Unit C C C Table 2. Symbol VBR IRM VRM Cline Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Input capacitance per line VBR VRM IR IRM IRM IR VRM VBR V I Symbol VBR IRM R1, R2 R3 Cline Matching Test conditions IR = 1 mA VRM = 5 V per line I = 10 mA I = 1 mA @0V Serial resistance matching Tolerance Min. 6 Typ. Max. 9 1 Unit V A k pF % 5% 5% 33 1.5 30 1 2/7 EMIF02-USB05C2 Characteristics Figure 1. 0.00 S21 (dB) attenuation measurement Figure 2. dB 0.00 -10.00 -20.00 Analog crosstalk measurements dB -10.00 -30.00 -40.00 -20.00 -50.00 -60.00 -70.00 -30.00 -80.00 -90.00 1.0G -100.00 100.0k 1.0M F (Hz) -40.00 100.0k 1.0M 10.0M 100.0M F (Hz) 10.0M 100.0M 1.0G Figure 3. ESD response to IEC 61000-4-2 Figure 4. (+15 kV air discharge) on one input (Vin) and on one output (Vout) ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (Vin) and on one output (Vout) V(in) 5 V/d V(in) 5 V/d V(out) 5 V/d V(out) 5 V/d 100 ns/d 100 ns/d Figure 5. Junction capacitance versus reverse voltage applied CLINE (pF) 35 30 25 20 15 10 5 0 0 1 2 3 4 5 Vosc = 30 mV Vosc=30mV F=1MHz F = 1 MHz Tamb = 25 C Ta=25 C VLINE (V) 3/7 Ordering information scheme Figure 6. Aplac model device structure Lbump Rbump A1 D2 R3 B1 A2 EMIF02-USB05C2 bulk MODEL = D2 Lbump Rbump B2 Rbump Lbump R1 Rbump Lbump Rbump D1 MODEL = D1 MODEL = D1 MODEL = D1 Lbump Lbump Rbump bulk C1 bulk R2 bulk Lbump Rbump C2 MODEL = D1 MODEL = D1 Rbump Lbump bulk bulk Cgn d Lgn d MODEL = D1 MODEL = D1 Rgn d bulk bulk Figure 7. Aplac model parameters aplacvar R1 33 aplacvar R2 33 aplacvar R3 1.5k aplacvar Cz_D1 15pF aplacvar Rs_D1 1 aplacvar Cz_D2 300pF aplacvar Rs_D2 0.3 aplacvar Lgnd 100pH aplacvar Rgnd 100m aplacvar Cgnd 0.4pF aplacvar Lbump 50pH aplacvar Rbump 20m Diode D1 BV=7 IBV=1m CJO=Cz_d1 M=0.3333 RS=Rs_d1 VJ=0.6 TT=100n Diode D2 BV=7 IBV=1m CJO=Cz_d2 M=0.3333 RS=Rs_d2 VJ=0.6 TT=100n 2 Ordering information scheme EMIF EMI Filter Number of lines Information 3 letters = application 2 digits = version yy - xxx zz Cx Package C = Coated Flip-Chip x = 2: Leadfree Pitch = 500 m, Bump = 315 m 4/7 EMIF02-USB05C2 Package information 3 Package information Figure 8. Flip-Chip package dimensions 500 m 10 315 m 50 690 m 65 500 m 10 0.92 mm 50 m Figure 9. Foot print recomendations 1.92 mm 50 m Figure 10. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 m recommended, 300 m max E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 315 m copper pad diameter xxz y ww Figure 11. Flip-Chip tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm 8 +/- 0.3 STE STE STE xxx yww User direction of unreeling xxx yww xxx yww 4 +/- 0.1 5/7 Ordering information Note: More packing information is available in the application notes AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" EMIF02-USB05C2 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information Ordering code EMIF02-USB05C2 Marking GV Package Flip-Chip Weight 2.7 mg Base qty 5000 Delivery mode Tape and reel 7" 5 Revision history Date 14-Mar-2005 13-Nov-2006 Revision 1 2 Initial release. Reformatted to current standards. Modified functional diagram on page 1 to show connections. Updated Aplac model information. Changes 6/7 EMIF02-USB05C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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